Semiconductor Industry
In the realm of semiconductor manufacturing, Ceramic Injection Molding (CIM) and Metal Injection Molding (MIM) have emerged as transformative technologies. These methods integrate the precision of injection molding with the unique properties of ceramics and metals, respectively, to produce components critical to modern electronics.
The parts we produce through CIM and MIM can be used in semiconductor deposition, etching, degumming and cleaning processes.
MIM Supplier's injection molded metal and ceramic products, after CNC and surface treatment, can achieve a dimensional accuracy of 0.001mm and a roughness of Ra0.01
Semiconductor Parts Related Case
Thermal Pads
Thermal Pads are key components manufactured through metal powder metallurgy and are widely used in the semiconductor industry. With excellent thermal conductivity and precise dimensional control, the product can efficiently dissipate heat and ensure the temperature stability of the chip during high-performance operation.
Through the metal powder metallurgy process, Thermal Pads can achieve complex geometric shapes while having high density and uniformity. Its excellent material properties make it an indispensable thermal management solution in semiconductor equipment.
Precision Terminals
Precision Terminals are high-precision connection components manufactured by metal powder metallurgy, designed specifically for the semiconductor industry. Their high conductivity and dimensional accuracy ensure the stability and reliability of signal transmission, and are key components in chip packaging.
Using metal powder metallurgy, Precision Terminals can meet the needs of complex structures and high-performance materials, while also having excellent mechanical strength and durability. This process advantage makes it the first choice for high-precision, high-performance connection solutions in semiconductor equipment.
Printed Circuit Board
Metal powder metallurgy plays an important role in key components of computer motherboards, such as thermally conductive substrates, shielding covers and connection terminals. These components meet the semiconductor industry's demand for high-performance materials and complex geometries with their high precision, excellent thermal conductivity and mechanical properties, providing motherboards with efficient heat dissipation, electromagnetic interference shielding and reliable connection solutions.
We specialize in the production of high-precision metal powder metallurgy parts and are able to customize high-performance components with complex geometries according to customer needs. Through advanced production equipment and strict quality control, we provide reliable thermal management and connection solutions for the semiconductor industry, helping to improve the overall performance of equipment.
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We Are ISO 9001 : 2015 Certified!
XY-Global is a trusted supplier of 3C electronic components. Our ISO 9001 certification reflects our company's quality control and quality assurance system, ensuring that every product leaving the factory has been rigorously inspected and tested. We provide you with precise custom components and provide excellent service and support to ensure that you get the best products and solutions.
XY-Global is always customer-centric and committed to meeting your needs, providing high-quality electronic parts and professional services. We look forward to supporting you and helping you achieve project success!
Precision Manufacturing for Semiconductor Excellence
XY-Global has an experienced team of engineers, providing comprehensive technical support and after-sales service to solve any challenges during use. In addition, we ensure full traceability of the entire metal or ceramic injection molding process, providing Certificate of Origin (COA) and detailed records for each production stage.
